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Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)

General Information

Document Type:AWARD
Posted Date:Aug 24, 2017
Category: Research and Development
Set Aside:N/A

Contracting Office Address

Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 675 North Randolph Street, Arlington, Virginia, 22203-2114, United States

Description

Contract Award Date:         DTD 082217

Contract Award Number:    CNT HR0011-17-C-0089

Contract Award Amount:     AMT Phase 1/CLIN 0001 (Base) $4,283,842, Phase 2/CLIN 0002 (Option 1) $4,638,955, Phase 3/CLIN 0003 (Option 2) $2,329,414

Contract Line Item Number: 

Contractor:     TO Boeing Company, The, 325 J S McDonnell Blvd, Hazelwood, Missouri 63042, United StatesAward Notice for HR0011-17-C-0090: The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.|**|TO Boeing Company, The, 325 J S McDonnell Blvd, Hazelwood, Missouri 63042, United StatesAward Notice for HR0011-17-C-0090: The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.|**|TO Boeing Company, The, 325 J S McDonnell Blvd, Hazelwood, Missouri 63042, United StatesAward Notice for HR0011-17-C-0090: The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.

Original Point of Contact

POC Mark Jones, , William J Rockwood,

Place of Performance

Link: FBO.gov Permalink
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